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Feature

Specification

  • IC Bonding Technology

    COG

  • TP Structure

    内嵌式

  • Backlight Structure

    LED背光源

  • Brightness

    550±50

  • NTSC (1931)

    97.3%sRGB

  • Color Temperature

    7200±500

  • Screen Size

    6.1(英寸)

  • Screen Resolution

  • Full View (YES/NO)

    Non-Full View/Full View

  • IC Removable (YES/NO)

    YES

  • Screen Thickness

    2.2±0.1mm

    IC Bonding Technology

    COG

    TP Structure

    内嵌式

    Backlight Structure

    LED背光源

    Brightness

    550±50

    NTSC (1931)

    97.3%sRGB

    Color Temperature

    7200±500

    Screen Size

    6.1(英寸)

    Screen Resolution

    Full View (YES/NO)

    Non-Full View/Full View

    IC Removable (YES/NO)

    YES

    Screen Thickness

    2.2±0.1mm

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